The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 1996

Filed:

Jul. 20, 1994
Applicant:
Inventor:

Ronald D Denton, Spring, TX (US);

Assignee:

Compaq Computer Corporation, Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
22818022 ; 228212 ; 228 495 ;
Abstract

A method and apparatus are available for manufacturing a printed circuit board assembly by reworking a ball grid array component on a populated circuit board. The component is first aligned over the landing area on the board. Then hot gas is injected between the component and the board. This gas is hot enough to reflow the solder balls on the component. Then the component is connected to the landing area of the board. The component is held away from the board during the reflow step and is dropped onto the landing area after the solder balls reflow. A special nozzle and nozzle insert are used to hold the component away from the PCB by means of a vacuum suction.


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