Process and system for temperature control and in-line testing of

Abstract

A process and system exists for temperature control and testing of modules, such as printed circuit boards, with fitted electronic, electromechanical and mechanical components or individual components, wherein the modules are subjected, following assembly in a soldering process and when the solder joints are still in a semi-molten state, to one or more test phases at high and low temperature, in order to detect defects at an early stage and to take immediate corrective measures when errors occur. To this end, in a first test phase the modules are cooled, as they emerge from the soldering process, to a temperature ranging from 40.degree. to 125.degree. C. and tested in a first test phase. Thereafter, in a second test phase the modules are cooled to a temperature ranging from -40.degree. to 10.degree. C. and tested. In the respective test phase the modules are subjected to a component and/or function test in order to determine defective modules. Modules that are found to be faultless are then fed to a dispenser, whereas defective modules are sorted out from the path to the dispenser and an error message is sent. To improve the error inspection, the modules are provided with a digital code that can be read prior to the respective test phase, so that management of defective and faultless modules is possible with digital computers.