The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 1996
Filed:
Aug. 03, 1994
Kouji Tashiro, Chiba, JP;
Akira Kaneko, Chiba, JP;
TDK Corporation, Tokyo, JP;
Abstract
A multilayer inductor 1 is fabricated, for example, by sandwiching a first magnetic material sheet (21) between a second magnetic material sheet (22) and a third magnetic material sheet (23) and integrating the three layers. The first magnetic material sheet (21) is preferably at least 0.2 mm thick and has a first spiral conductor pattern (31) having an extreme lead-out portion (310) formed on its upper major surface. The first sheet (21) is provided with a through-hole (4) extending between the opposed major surfaces and having a larger diameter on the conductor pattern bearing surface. The through-hole (4) is filled with a conductor (35) contiguous to the first conductor pattern (31). The second magnetic material sheet (22) has a second spiral conductor pattern (32) having an extreme lead-out portion (320) formed on its upper major surface and connected to the conductor (35) in the through-hole (4). The magnetic material sheets (21, 22) on their major surfaces having the first and second conductor patterns (31, 32) formed thereon are provided with dummy conductor patterns (61, 65) which are spaced from and opposed to the extreme lead-out portions (310, 320), respectively, and external electrodes are connected. Benefits include easy fabrication, safe connection, least property variation, improved manufacturing yield and reliability.