The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 1996
Filed:
Jul. 19, 1993
Satoru Kishi, Yokohama, JP;
Toshiyuki Nakakura, Yokohama, JP;
Hiroshi Tanabe, Kamakura, JP;
Hideo Sakai, Ebina, JP;
Mitsui Toatsu Chemicals, Inc., Tokyo, JP;
Abstract
A molding obtained by laminating resinous plates of 0.05 to 1 mm thick, prepared by impregnating 20% by volume or more of a reinforcing fiber with a thermoplastic resin, and molding the resultant laminate, wherein sections where deviation or deformation is caused by an external force, or preferably nonjoining parts having an area of 5 to 60% based on the area of the location where impact is absorbed, are provided between the laminated layers constituting the molding, or the laminated layer surface where the impact is absorbed is formed with a shape having a curvature of 5 to 20 mm in radius. The molding absorbs impact force significantly and prevents efficiently human body, etc. from the shock upon striking.