The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1996
Filed:
Feb. 16, 1994
Robert C Abbe, Newton, MA (US);
Noel S Poduje, Needham Heights, MA (US);
Randal K Goodall, North Chelmsford, MA (US);
Peter Domenicali, Montpelier, VT (US);
ADE Corporation, Newton, MA (US);
Abstract
A system for semiconductor wafer processing including wafer measurement and characterization having vertical wafer processing apparatus with which only the edge of a wafer is contacted. A wafer processing station is provided having a support bridge to which a rotor subassembly is attached. The rotor subassembly includes a housing and a rotor having a central aperture and a retention mechanism for retaining a wafer in a measurement position. A pair of pivotable probe arms includes one probe arm positioned on either side of the wafer. A sensor provides an image of a wafer prior to its retention by the retention mechanism in the measurement position in order to permit the retention mechanism to avoid any flat on the wafer. Additional sensors eliminate the effect of wobble or vibration of the rotor on wafer measurement results. Artifact removal processors are provided for removing errors in the measured wafer data and a database stores the uncorrupted and corrected data. The system couples with a data network to allow global viewing of wafer processing trouble spots. A correlation of information from actual data and wafer processing simulation is provided for allowing the application of corrective measures before processes deviate beyond control or specification limits.