The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1996
Filed:
Jul. 01, 1994
Applicant:
Inventors:
Hidekazu Matsuura, Oyama, JP;
Yoshihide Iwasaki, Tsukuba, JP;
Kaori Ikeda, Beppu, JP;
Takayuki Suzuki, Shimodate, JP;
Masashi Tanaka, Shimodate, JP;
Yasuo Miyadera, Tsukuba, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ; C08L / ;
U.S. Cl.
CPC ...
525423 ; 525422 ; 525424 ; 525438 ; 525510 ; 525528 ; 525530 ; 525533 ; 525928 ; 428355 ; 428413 ; 4284735 ;
Abstract
A polymide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.
Quick Actions:
Matsuura, Hidekazu. (1996). Polyimides, thermosetting resin compositions containing the polyimides, (U.S. Patent No. 5510425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5510425
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile