The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1996
Filed:
Sep. 12, 1994
Applicant:
Inventor:
Donald J Redwine, Houston, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437203 ; 437195 ; 437192 ; 437245 ;
Abstract
An integrated circuit interconnect structure is provided, along with a method of forming the integrated circuit interconnect structure. A semiconductor material layer has an elongate trench formed therein. A conducting region is disposed in the trench. An insulator region overlies the conducting region. One or more contact regions are disposed through the insulator region to contact the conducting region.
Redwine, Donald. (1996). Method of interconnect in an integrated circuit (U.S. Patent No. 5510298). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5510298
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile