The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 1996

Filed:

Apr. 03, 1995
Applicant:
Inventor:

Kraig A Quinn, Webster, NY (US);

Assignee:

Xerox Corporation, Stamford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437-3 ; 437 53 ; 437205 ; 437212 ; 437214 ; 437216 ; 437249 ;
Abstract

A process for manufacturing semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. Before chips are tacked onto the substrate with uncured epoxy, the substrate is urged evenly against a work surface defining a concave bow. The radius of curvature of the concave bow is calculated as a function of the desired spacing between adjacent chips. When the substrate having chips tacked thereon is released form the work surface, neighboring chips have parallel adjacent surfaces of the desired spacing.


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