The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 1996

Filed:

Nov. 16, 1992
Applicant:
Inventors:

Masataka Tamura, Kanagawa, JP;

Yutaka Ishiwata, Kanagawa, JP;

Yoshiyasu Itoh, Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F / ;
U.S. Cl.
CPC ...
165171 ; 165168 ;
Abstract

A heat-resisting plate employed in various devices that handle high temperature plasma or high energy particles, including a metallic substrate having a cooling structure wherein cooling pipes are embedded against the substrate by a thermal spray layer of the same material as the metallic substrate on one or both faces of the metallic substrate. In forming the heat-resisting plate, the metallic substrate is processed to the form of a plate, cooling pipes are arranged on one or both faces of this metallic substrate, and the cooling pipes are fixed by spraying a thermal spray layer on the face or faces of the metallic substrate where the cooling pipes are arranged, thereby to embed the cooling pipes between the thermal spray layer and the metallic substrate.


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