The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1996
Filed:
Jul. 21, 1994
Applicant:
Inventor:
Chikara Yamashita, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ; H01R / ; G01R / ;
U.S. Cl.
CPC ...
29879 ; 29852 ; 29884 ; 228 563 ; 324537 ; 439 91 ;
Abstract
It is the object of the invention to provide a method for manufacturing a sheet formed connector for inspecting an integrated circuit at the state of flip-chip bonding and at low pressure condition. The method for manufacturing comprises the steps of making holes on plastic insulating sheet, which is stuck to the metallic sheet, at a certain interval in both longitudinal and lateral directions, making predetermined patterned portions on the metallic sheet by etching, and melting a solder piece in each hole.