The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 1996
Filed:
Jul. 21, 1994
Kazuhisa Miyaguchi, Hamamatsu, JP;
Tetsuhiko Muraki, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu, JP;
Abstract
The solid state image sensor comprises a chip in a package. A image sensor is formed in the chip. The package has a package main body, a light receiving glass plate fixed to the package main body, and a buffer member arranged between the package main body and light receiving glass plate. The buffer member is fixed to the light receiving glass plate and to the package main body. The thermal expansion coefficient of the buffer member is substantially equal to that of the light receiving glass plate, so that the light receiving plate is fixed to the package main body even though the temperature of the imaging device changes. Therefore, the adhesion between the package main body and the light receiving glass plate and the airtightness in the package are maintained.