The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 1996
Filed:
Oct. 28, 1993
Applicant:
Inventors:
William C Robinette, Jr, Los Altos Hills, CA (US);
Chung W Ho, Monte Sereno, CA (US);
Assignee:
Digital Equipment Corporation, Maynard, MA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257700 ; 257692 ; 257701 ; 257778 ;
Abstract
An interconnect structure formed of a flexible, multilayer dielectric material such as polyimide, having a support ring, connection points on the section inside the support ring for connecting one or more semiconductor chips, and connection points outside the support ring for connecting to a circuit board. Alignment templates are disclosed which align the semiconductor chip with the connection points.
Robinette, Jr, William. (1996). High density, high speed, semiconductor interconnect using-multilayer (U.S. Patent No. 5508558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5508558
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile