The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1996
Filed:
Sep. 26, 1994
Claude L Bertin, So. Burlington, VT (US);
Paul A Farrar, So. Burlington, VT (US);
Gordon A Kelley, Jr, Essex Junction, VT (US);
Christopher P Miller, Underhill, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A fabrication method and resultant electronic module that facilitates relief of thermally induced stress within the module. The fabrication method includes providing a plurality of integrated circuit chips having grooves in substantially planar main surfaces thereof. The chips are stacked and bonded to each other using an expandable material and a flowable adhesive to form an electronic module. The bonding is such that movement of individual IC chips within the module, in a direction perpendicular to their planar surfaces, is restricted. Upon thermal expansion of the module, the expandable material and the individual chips expand at different rates. However, the expandable material flows into the grooves, relieving thermally induced stress.