The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1996
Filed:
Jan. 13, 1995
Helmut Bacher, Brookings, OR (US);
Other;
Abstract
A microwave test fixture (10) for testing a two port microwave integrated circuit (MIC) (11) including a first signal block (12) and an opposing second signal block (14). Each signal block (12 and 14) includes an inside face (20 and 36) with an overhang portion (30 and 46), a vertical channel (52 and 62) and a connector aperture (70 and 72). The connector apertures (70 and 72) each receive a connector assembly (78 and 80) that includes a coaxial connector (82 and 108), a conductive sleeve (84 and 110) and an insulative bead (112 and 86). A signal contact (88 and 114) extends from an inner conductor 90 of each coaxial connector (82 and 108), through the insulative bead (112 and 86) and vertical channel (52 and 62) and out from the inside face (20 and 36) below the overhang portion (30 and 46). Each signal contact (88 and 114) includes a contact spring section (100). A circuit bed (16) is disposed between the signal blocks (12 and 14) and includes a ground leaf spring (146) with a first ground end (148) and a second ground end (150). The circuit bed (16) moves vertically between a test position and a load position. In the load position the circuit bed (16) is lowered to receive the MIC (11). In the test position the circuit bed (16) contains the MIC (11) and is raised so that a top of the MIC (138) contacts the overhang portions (30 and 46), the signal contacts (88 and 114) contact the MIC pads (176 and 178), and the ground ends (148 and 150) make simultaneous contact with an MIC ground plate (172) and the inside faces (20 and 36) of the signal blocks (12 and 14), providing a short current ground path between the MIC (11) and the signal blocks (12 and 14).
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