The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 1996

Filed:

Oct. 20, 1993
Applicant:
Inventors:

Shinya Yamamoto, Kyoto, JP;

Hirokazu Higuchi, Kyoto, JP;

Mitsuro Hamuro, Kyoto, JP;

Toshihiko Kogame, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156264 ; 156 89 ; 156261 ; 29 2542 ; 3613212 ; 264 58 ; 264 61 ; 264153 ;
Abstract

In order to manufacture a multilayer ceramic electronic component such as a multilayer ceramic capacitor, a long ceramic green sheet is prepared, and this long ceramic green sheet is fed along its longitudinal direction and is successively subjected to steps of printing conductor films on the surface of the long ceramic green sheet with conductive paste, drying the conductor films, punching out the long ceramic green sheet into ceramic green sheets of prescribed sizes at prescribed punching positions with respect to the location of the conductor films, and stacking the punched ceramic green sheets with each other. The long ceramic green sheet is punched out under two types of different registering conditions with respect to the conductor films in the punching step, and ceramic green sheets obtained under the two different types of registering conditions are stacked with each other in the stacking step, so that conductor films having the same geometry can define internal electrodes for a multilayer ceramic capacitor. Capacitance provided by the multilayer ceramic capacitor can be changed by changing the registering conditions with respect to the locations of the conductor films in the punching step.


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