The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 1996
Filed:
Sep. 16, 1994
Alan D Foster, Los Altos, CA (US);
Mark P August, Los Gatos, CA (US);
Apple Computer, Inc., Cupertino, CA (US);
Abstract
A unitary heat sink including a planar contact portion for contacting the top of an IC. The heat sink is constructed from a material having a thermal conductivity of at least 150 watts per meter Degree Kelvin (W/m.degree.K.) but preferably is constructed from aluminum having a conductivity of 221 (W/m.degree.K.). A number of leg portions extend from the contact portion such that each leg portion has a distal end. The leg portions, being made of the same material as the contact portion, are configured to have a sufficient resiliency such that deformations of the leg portions provide a spring force in the range of 5 to 16 lbs against the top of the IC. A method for dissipating heat from an integrated circuit includes the steps of forming a unitary heat sink from a heat sink material, where the heat sink includes a contact portion and a number of integral, spring leg portions. The method continues with the attachment of an integrated circuit to a printed circuit board, and the attachment of the leg portions of the heat sink to the printed circuit board such that the contact portion of the heat sink is urged towards the heat transfer surface of the integrated circuit with a spring force in the range of 5 to 16 lbs.