Interconnect substrate with circuits for field-programmability and

Abstract

An interconnect structure contains an interconnect substrate, multiple component contacts formed on the interconnect substrate for receipt of electronic components, and multiple conductive traces formed on the interconnect substrate. Each conductive trace is electrically connected to one of the component contacts. An IC having a group of parallel of conductive leads is mounted on the substrate. At least one of the conductive leads is divided into two or more segments. One or more of the conductive leads or segments are connected to corresponding conductive traces on the interconnect substrate. In one embodiment, the IC is a programmable chip having programmable elements for selectively connecting the conductive leads or segments, thereby enabling a user to interconnect selected conductive traces on the interconnect substrate to achieve a desired electrical function from the electronic components connected to the substrate. In another embodiment, the IC contains active devices for testing the IC's conductive leads, the conductive traces on the substrate, and/or the electronic components mounted on the component contacts.