The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 1996
Filed:
Jul. 09, 1991
Martin J Goldberg, Mahopac, NY (US);
Hiroshi Ito, San Jose, CA (US);
Caroline A Kovac, Ridgefield, CT (US);
Michael J Palmer, Walden, NY (US);
Roger A Pollak, Pleasantville, NY (US);
Paige A Poore, Durham, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.