The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 1996

Filed:

Sep. 29, 1994
Applicant:
Inventor:

Michitaka Urushima, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228-11 ; 228 447 ;
Abstract

A bonding tool for connecting inner leads to pads of a semiconductor chip by means of high efficiency transmittance of ultrasonic vibrations is disclosed. The shape of the tool as seen in a plane parallel to the ultrasonic vibration is either to have a substantially flat plane on one side and a uniformly continuous sloped plane with a predetermined angle starting from a pressing face against the inner lead, or to have the shape of a uniformly continuous machined conical surface starting upwardly from the pressing face until the diameter of the cone reaches 200 .mu.m or more.


Find Patent Forward Citations

Urushima, Michitaka. (1996). Bonding tool employed in ultrasonic compression bonding apparatus (U.S. Patent No. 5503321). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5503321

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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