The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 1996

Filed:

Oct. 07, 1994
Applicant:
Inventor:

Yoshio Adachi, Kodaira, JP;

Assignee:

AUE Institute, Ltd., Kodaira, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H01L / ;
U.S. Cl.
CPC ...
361760 ; 2281801 ; 22818021 ; 22818022 ; 257737 ; 257797 ; 361777 ; 361779 ; 361782 ; 361783 ; 437212 ;
Abstract

A new and improved electronic circuit and a method of producing the same is provided in which at least one electronic element is ultrasonically welded to a printed circuit board to create the electronic circuit. Proper alignment between terminals of a conductive circuit pattern on the circuit board and terminal units on the connecting surface of the electronic element is ensured by a variety of techniques: (i) small protuberances on the terminal units, (ii) raised sections on the bottom surface of the terminal units placed to engage indented portions of the board, and (iii) corresponding posts (on the electronic elements) and holes (formed on the circuit board). The ultrasonic welding of the element to the printed circuit board is typically conducted at a frequency range between 25-30 megahertz which produces a vibration which grinds the terminal units of the electronic element to the terminals of the circuit pattern while also welding the element and circuit board together. Electronic circuits formed in accordance with the inventive concept disclosed herein can be comprised of stacked or interlocking combinations of weldable electronic elements. Such structures can improve rigidity and vary spacial relationships of electronic circuits.


Find Patent Forward Citations

Loading…