The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 1996
Filed:
Oct. 06, 1993
Henri Mabboux, Saint Martin le Vinoux, FR;
Michel Mermet-Guyennet, Saint Egreve, FR;
Thomson Composants Militaires et Spatiaux, Courbevoie, FR;
Abstract
The invention relates to the encapsulation of integrated circuits, and more particularly encapsulation in a multi-layer ceramic case. In order to permit the disposition of chips of variable size on a monolithic chip (22, 24, 26) reception site (23, 25, 27) without the risk of having excessively long connection wires between the chip and the conductive regions (44) surrounding the reserved site, it is proposed according to the invention to cover the chip-reception site with a number of mutually insulated conductive contacts which can serve as soldering relays for these connection wires (80, 90, 100). If the chip is large (chip 24) it is bonded or soldered to these contacts; if it is small (chip 22) it is surrounded by relay-contacts.