The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1996
Filed:
Jun. 28, 1993
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
21912163 ; 21912164 ; 21912183 ;
Abstract
An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.
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Horita, Manabu. (1996). Bonding method and apparatus (U.S. Patent No. 5500502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5500502
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