The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1996
Filed:
May. 23, 1995
Applicant:
Inventor:
Byung J Cho, Bubaleub, KR;
Assignee:
Hyundai Electronics Industries Co., Ltd., Kyoungkido, KR;
Primary Examiner:
Int. Cl.
CPC ...
B05C / ;
U.S. Cl.
CPC ...
118712 ; 118666 ; 118668 ; 118708 ; 1187 / ; 118725 ;
Abstract
An apparatus for manufacturing a semiconductor layer using rapid thermal processing, the apparatus comprising: a chamber for processing a wafer; a first microwave source for appling microwave to a center portion of said wafer, being formed on one side of said chamber; and a second microwave source for appling microwave to the edge portion of said wafer, being formed on the other side of said processing chamber; a gas inlet for injecting a processing gas into said processing chamber, being formed in top of said processing chamber; a gas outlet for exhausting said processing gas in said processing chamber.