The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1996
Filed:
Dec. 19, 1994
Applicant:
Inventor:
Tomoo Murakami, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K / ;
U.S. Cl.
CPC ...
29852 ; 29829 ; 29846 ; 174260 ; 174262 ; 174265 ; 22818021 ; 427 97 ;
Abstract
The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated, filling in the hole with copper paste, forming a circuit pattern such that a copper foil portion remains only in one half of the hole, and etching an exposed region of the substrate. No mechanical process is used in the formation of the end face through-hole so that it is free from the development of burrs in or peeling off of a conductive layer.