The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 1996

Filed:

Jul. 07, 1994
Applicant:
Inventors:

Nakaba Nakamura, Kyoto, JP;

Makoto Kosaki, Kyoto, JP;

Assignee:

Susumu Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
29600 ; 29830 ; 29841 ;
Abstract

A delay line device having first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of the ceramic substrate identical in thickness and material to the ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.


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