The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 1996

Filed:

Jun. 06, 1995
Applicant:
Inventors:

Robert R Turnbull, Buchanan, MI (US);

David J DeLisle, Berrien Springs, MI (US);

Robert A Kohtz, St. Joseph, MI (US);

Assignee:

Zenith Data Systems Corporation, Buffalo Grove, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
324760 ; 365211 ; 365222 ;
Abstract

A method and circuit for relatively accurately measuring the die temperature of an IC, such as a microprocessor, by sensing one or more internal circuit elements which have an electrical parameter which varies as a function of temperature, such as an input protection diode. By sensing the one or more circuit elements which have an electrical parameter that is temperature dependent, the method provides a relatively more accurate measurement of the die temperature than measuring the outside temperature of the IC package. In addition, a control circuit is provided for cooling the IC during excessive temperature conditions by slowing down the clock frequency of the IC until the die temperature is within the temperature limit in order to optimize the utility of the IC during excessive temperature conditions.


Find Patent Forward Citations

Loading…