The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 1996
Filed:
Oct. 11, 1994
Wyatt A Huddleston, Austin, TX (US);
James J Casto, Austin, TX (US);
Motorola, Inc., Schumburg, IL (US);
Abstract
A process for positioning bond pads around a semiconductor die periphery on an octant basis, taking into account both manufacturing and design limitations. The process positions bond pad centers such that the spacing (pitch) increases towards the die corners. The pitch increase is iteratively calculated from an approximated wire angle. The process iteratively recalculates an octant's pad positions until optimum values are converged upon for the approximated wire angle of the cornermost bond pad and for the furthest allowable position for the cornermost bond pad. Once these optimum values are achieved, the resulting bond pad coordinates are stored in memory or a storage media in a format readable by a layout tool being used to design the die (or package). The resulting file is imported into the layout tool, which uses the stored information to physically position bond pads around the die periphery in the die layout.