The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 1996
Filed:
Aug. 25, 1994
Shoichi Ikejima, Tokyo, JP;
Tetsu Yamanaka, Tokyo, JP;
Takeshi Koishihara, Tokyo, JP;
Kenichi Shibuya, Tokyo, JP;
Satoshi Chonan, Tokyo, JP;
Riso Kagaku Corporation, Tokyo, JP;
Abstract
A heat-sensitive stencil sheet consisting of a porous substrate and a thermoplastic film adhered to the substrate is provided without no use of an adhesive. The porous substrate comprises a screen cloth wholly or partially consisting of conjugate fibers (a sheath-core type or a side-by-side type) one exposed component of which has an affinity with the thermoplastic resin film and having a melting point lower than that of the other component of the conjugate fiber and lower than that of the thermoplastic resin, and the screen cloth is adhered to the thermoplastic resin film through the exposed component. The heat-sensitive stencil sheet can be produced by superposing the thermoplastic resin film on the substrate and heating under pressure the superposed film and substrate at the softening point or higher of the above exposed component of the conjugate fiber and at a temperature lower than the melting point of the other component of the conjugate fiber and lower than the melting point of the thermoplastic resin.