The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 1996

Filed:

Dec. 15, 1994
Applicant:
Inventors:

Tadao Toyama, Shizuoka, JP;

Hitoshi Hagiwara, Shizuoka, JP;

Nobuyuki Kita, Shizuoka, JP;

Assignee:

Fuji Photo Film Co., Ltd., Minami-ashigara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F / ; G03F / ; G03F / ; G03F / ;
U.S. Cl.
CPC ...
430162 ; 430166 ; 4302731 ; 4302781 ; 430302 ;
Abstract

A presensitized plate for use in making a lithographic printing plate comprises a substrate; a photosensitive layer and a mat layer whose projections have an average diameter of not more than 100 .mu.m, an average height of not more than 10 .mu.m and whose coated amount ranges from 5 to 200 mg/m.sup.2, the photosensitive layer and the mat layer being applied onto the upper surface of the substrate; and a coating layer of an organic polymeric compound having a glass transition point of not less than 20.degree. C. and a thickness ranging from 0.01 to 8.0 .mu.m, the coating layer being applied onto the back face of the substrate. The presensitized plate makes it possible to solve the problem of the formation of scratches and the adhesion of the photosensitive layer to the back face of the PS plate even when a large number of PS plates are transported and/or stored while putting them in piles without sandwiching the PS plate between interleaves. The coated layer applied to the back face of the PS plate is tough and shows good adhesion to the substrate and is not peeled off during handling, development processing and printing operations.


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