The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 1996
Filed:
Oct. 05, 1993
Shin Fujitani, Moriguchi, JP;
Hiroshi Nakamura, Moriguchi, JP;
Hiroshi Watanabe, Moriguchi, JP;
Ikuo Yonezu, Moriguchi, JP;
Toshihiko Saito, Moriguchi, JP;
Sanyo Electric Co., Ltd., Moriguchi, JP;
Abstract
A hydrogen absorbing alloy represented by the general formula R.sub.1-x A.sub.x (Ni.sub.5-y B.sub.y).sub.z wherein R is Mm (misch metal) or La, A is at least one element selected from the group consisting of Ce, Nd, Pr, Sm and Y, B is at least one element selected from the group consisting of Al, Sn, V, Cr, Mn, Fe, Co and Cu, 0.ltoreq.x.ltoreq.0.5, 0<y.ltoreq.1.0 and 0.8.ltoreq.z.ltoreq.1.2. The alloy is prepared by subjecting an alloy material of the above composition to a heat treatment so that when the plateau region of the resulting hydrogen absorbing alloy is expressed by a normal cumulative distribution function wherein the hydrogen content of the alloy is taken as frequency and the logarithm of the equilibrium hydrogen pressure of the alloy as a random variable, the alloy is at least 0.04 to up to 0.10 in standard deviation .sigma..