Compositions, epoxized compositions, a heat curable resin composition,

Abstract

Compositions(I), (II) and (III) comprising compounds having vinyl groups as side chains and epoxidized compositions(XI), (XII) and (XIII) thereof, which can be prepared by the various reaction combinations of (a) with (b) or (b)+(c), and or (d), where (a) is at least one compound having at least one vinyl group and one epoxy group in the molecule; (b) is at least one of a polybasic compound, an anhydride thereof, a polymer having carboxylic groups at terminals and a polymer having carboxylic groups as side chains; (c) is at least one organic compound having at least one active hydrogen atom; and (d) is at least one of an unsaturated monocarboxylic compound or an unsaturated monocarboxylic ester having a hydroxyl group.