The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 1996

Filed:

Apr. 06, 1994
Applicant:
Inventors:

Hideyasu Asakage, Tokyo, JP;

Michio Aritomi, Chiba, JP;

Xiao Li Wu, Tsuchiura, JP;

Assignee:

Totokasei Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
523427 ; 523428 ; 523443 ; 523466 ; 525481 ; 525482 ; 525484 ; 528102 ; 528103 ; 549560 ;
Abstract

An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).


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