The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 1996
Filed:
Jun. 09, 1994
Applicant:
Inventor:
Hisamitsu Suzuki, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437 59 ; 437192 ; 437193 ; 437200 ;
Abstract
A process of fabricating a bi-CMOS integrated circuit device has a step of selectively growing doped polysilicon over a source/drain region and a part of base region exposed to contact holes formed in a silicon oxide layer without residue of the doped polysilicon on the silicon oxide layer, thereby preventing the bi-CMOS integrated circuit device from undesirable short circuit.