The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 1996
Filed:
Feb. 21, 1995
Kenji Hyodo, Tokyo, JP;
Mitsubishi Paper Mills Limited, Tokyo, JP;
Abstract
Disclosed is a method for making a printed circuit board which comprises providing a photoconductive layer by electrodeposition method on a metal conductive layer provided on at least one side of an electrically insulating substrate, forming a toner image on said photoconductive layer by electrophotographic process, then dissolving and removing the area of the photoconductive layer not covered by the toner using a printer and optionally etching the surface of the area of the substrate from which the photoconductive layer has been removed. According to this method, by employing especially the electrophotographic reversal development, a printed circuit board of excellent sensitivity and high resolution can be produced even from both-side copper-clad laminate sheets having through-holes of a high aspect ratio using an exposure source of low energy such as semiconductor laser.