The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 1996

Filed:

Mar. 15, 1994
Applicant:
Inventors:

Derek Johnson, Tempe, AZ (US);

Mavin C Swapp, Gilbert, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 72 ; 439 68 ;
Abstract

A cantilever spring (16) and a method for temporarily coupling a semiconductor package (36) to a transmission line (14) by means of the cantilever spring (16). The cantilever (16) has first and second pressure points (22, 32) that contact the transmission line (14). A force is applied to a third pressure point (32) which moves the first and second pressure points in opposite directions along the transmission line (14). In addition, the force on the third pressure point moves an end (21) of the cantilever spring (16) in a direction away from the transmission line (14). A lead (37) from the semiconductor package (36) contacts a portion of the end (21). Electrical signals are transmitted between the semiconductor package (36) and a tester via the cantilever spring (16) and the transmission line (14), wherein the electrical signals are for testing a semiconductor device (30).


Find Patent Forward Citations

Loading…