The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 1996

Filed:

Nov. 04, 1994
Applicant:
Inventors:

Thomas E Smith, Morris County, NJ (US);

Robert Zappulla, Lebanon, NJ (US);

George G Zipfel, Jr, Summit, NJ (US);

Assignee:

AT&T Corp., Murray Hill, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
310328 ; 310366 ;
Abstract

This disclosure describes a method for producing high-performance layered-element electrostrictive or piezoelectric actuators, and the resulting product. The process calls for steps that minimize decreases of the stack stiffness which usually characterize layered wafer actuators. These include making the wafers flat and parallel, using a referred wafer metalization process that does not affect wafer surface roughness, and using stock-bonding epoxies with viscosities which readily permit the bonding agent to 'wick' into the interface areas of the wafer/electrode stacks thereby to minimize the bond agent thickness.


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