The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 1996
Filed:
Oct. 07, 1993
Applicant:
Inventor:
Takeshi Moriwaki, Osaka, JP;
Assignee:
Kishimoto Sangyo Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
525429 ; 523208 ; 524494 ; 524495 ; 524538 ; 525 66 ; 525167 ; 525183 ; 525432 ; 525420 ;
Abstract
Thermoplastic molding resin composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.