The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 1996

Filed:

Sep. 07, 1994
Applicant:
Inventors:

James T Lowder, Columbus, OH (US);

Roy F Wielonski, Worthington, OH (US);

Kosta L George, Southbridge, MA (US);

Assignee:

Abrasive Technology, Inc., Westerville, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
428565 ; 428546 ; 428548 ; 428551 ; 428552 ;
Abstract

An improved method of making a monolayer abrasive tool using a relatively low melting point, soft filler metal alloy braze which possesses sufficiently high yield strength combined with a relatively high ductility and low elastic modulus to produce an exceptional bond between a monolayer of superabrasive particles and the tool substrate. The steps of the brazing process include applying a layer of the filler metal alloy including a an active metal in either pre-alloyed or as a mixture with the metal alloy and a monolayer of superabrasive crystals over the filler metal layer. This assembly is heated in a mon-oxidizing atmosphere such as a vacuum to melt the alloy and braze bond the superabrasive particles to the tool substrate. The alloy bond formed possess the properties of a ductility of at least 20 percent elongation, an elastic modulus of less than 15.times.10.sup.6 or less, and a yield strength preferably at least about 45,000 to 50,000 psi. A copper/silver based alloy including about 8 to 15 weight percent indium and 1 to 4 weight percent titanium is used in a preferred embodiment of the method disclosed.


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