The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 1996

Filed:

Feb. 21, 1995
Applicant:
Inventor:

Earl R Nicewarner, Jr, Gaithersburg, MD (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361760 ; 361735 ; 361790 ; 361749 ; 257686 ; 257778 ; 257787 ;
Abstract

An integrated circuit package that includes three base substrate support members. One base substrate support member is rigid and has two sides and the other two base substrate members are flexible and are located adjacent each side of the rigid base substrate support member. Each flexible base substrate support member has an inner surface and a series of flip chips are located between the inner surfaces of the flexible base substrate support members and the sides of the rigid base substrate support member. The three base substrate support members are electrically connected together and a termination connection is provided at one end of the assembly. In addition, logic chips are provided that are located adjacent the connector for controlling the various flip chips.


Find Patent Forward Citations

Nicewarner, Jr, Earl. (1996). Three-dimensional modular assembly of integrated circuits (U.S. Patent No. 5491612). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5491612

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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