The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 1996
Filed:
Dec. 28, 1994
Peng-Cheng Lin, Cupertino, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
An electric packaging arrangement for isolated circuits is described. A lead frame is formed with at least one off-centered tie bar connected between one of the circuits on the lead frame's internal lead and an external handling side rail. The tie bar is off-centered by a specified distance from the longitudinal center line of the package. The external side rail is used to support and align the lead frame during manufacturing. To meet safety requirements, such as the UL-1950 requirements, electrical components in a primary circuit and a secondary circuit are attached and electrically coupled to the lead frame in a manner such that the smallest internal distance between internal circuits is at least a predefined distance. The external distance between the tie bar, connected to the secondary circuit, and the closest primary circuit pin is set to meet external circuit component spacing requirements for isolated circuits. The described arrangement has a number of applications including packaging isolated circuits using small form factor packages such as dual-in-line (DIP) and small outline (SO) packages.