The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 1996
Filed:
Nov. 18, 1994
Applicant:
Inventors:
Yasuhide Ohno, Tokyo, JP;
Yoshio Ohzeki, Tokyo, JP;
Assignee:
Nippon Steel Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; H01L / ;
U.S. Cl.
CPC ...
428606 ; 148430 ; 420507 ; 420510 ;
Abstract
This invention relates to a bonding wire (3) for connecting electrodes of a semiconductor element to outer leads (2). The bonding wire (3) consists of Cu of not less than 1 wt % but less than 5 wt %, and the balance Au and incidental impurities. The bonding wire is superior in rupture strength and bonding strength. Even if the diameter is thinned to about 10 .mu.m, high reliability may be insured for connection.