The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 1996

Filed:

Apr. 28, 1994
Applicant:
Inventors:

Jyn-Bang Shyu, Cupertino, CA (US);

Roubik Gregorian, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03M / ;
U.S. Cl.
CPC ...
341136 ; 341144 ;
Abstract

Power dissipation is reduced in a video DAC by providing a sleep mode in which DAC current sources are shut off during the blanking period in a manner that allows them to be rapidly turned back on at the end of sleep mode. In particular, a digital to analog converter includes a current source for producing a current, a current steering circuit connected to the current source, the current steering circuit including switches responsive to first and second control signals, respectively, for steering the current into either a load or a current return path, and a control circuit for generating the first and second signals each as a logical combination of a video data signal and a sleep signal. The sleep signal, when it is active, causes both the first and second switches to turn off, which in turn causes the current source to turn off. In a preferred embodiment, the switches are MOSFETS having low gate capacitance. At the end of sleep mode, the current source may be rapidly turned back on by turning on one of the MOSFETS. Performance of the video DAC is therefore not affected, while power dissipation is substantially reduced, facilitating higher-level integration and compliance with the Green PC standard. Reduced power dissipation also allows for use of an inexpensive chip package, reducing manufacturing cost, and increases reliability of the chip.


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