The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 1996
Filed:
Jun. 18, 1993
Applicant:
Inventors:
Tokumitsu Sakamoto, Fukuoka, JP;
Yuzuru Konishi, Fukuoka, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H02B / ;
U.S. Cl.
CPC ...
257688 ; 257689 ; 257712 ; 257713 ; 257718 ; 257719 ; 361707 ; 361714 ;
Abstract
A semiconductor substrate (2) is pressed against heat compensators (6, 31) for electrical contact therewith without brazing. Silicone rubber (32) fixes the outer peripheral edge of the semiconductor substrate (2) and its adjacent portion on the heat compensator (31), preventing position shifts of the semiconductor substrate (2) without thermal distortion and, accordingly, preventing damages to the semiconductor substrate (2). The absence of thermal distortion, spikes, voids due to brazing permits the prevention of electrical characteristic deterioration.