The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 1996
Filed:
Nov. 04, 1994
Hiroshi Matsuoka, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate having opposite front and rear surfaces; lower electrodes disposed on the front surface of the substrate and a rear electrode disposed on the rear surface of the substrate; an air-bridge wiring disposed on the front surface of the substrate and connecting two of the lower electrodes; a via-hole penetrating through the semiconductor substrate in the vicinity of the two selected lower electrodes; and via-hole wiring disposed in the via-hole and connecting the selected lower electrodes to the rear electrode, the air-bridge wiring and the via-hole wiring being a continuous, unitary electroplated metal film. The air-bridge wiring and the via-hole wiring are directly connected without any intermediate wiring so that a junction of these wirings has no contact resistance. Further, since these wirings are continuous in the electroplated metal film, mechanical strength and reliability are improved.