The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 1996

Filed:

Jun. 01, 1994
Applicant:
Inventor:

Robert E Jones, Jr, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B / ; G11B / ;
U.S. Cl.
CPC ...
360104 ; 360126 ;
Abstract

A combination suspension and transducer magnetic head for longitudinal recording which can be used for contact recording and flying above the media. The transducer includes a horizontal first pole piece and a horizontal and vertical sectioned second pole piece. The magnetic gap is formed between the first pole piece and the vertical section of the second pole piece. The suspension layers are formed mainly from the insulation layer that separate the first horizontal pole piece and the horizontal section of the second pole piece, and an insulation layer that covers and protects the transducer layers. The layers of the combination head are deposited on a wafer in a row and column configuration. A release layer is deposited on the substrate first and then the individual thin film layers of the transducer are deposited. A horizontal first pole piece is formed. A horizontal section of a second pole piece is formed and activated by a conductor coil wound around the horizontal section. The backgap is displaced horizontally from the poletips. The wafer is then divided into rows. The vertical section of the second pole piece is formed on the end of the row in contact with its horizontal section. The substrate is removed by attacking the release layers.


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