The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 1996

Filed:

Mar. 29, 1993
Applicant:
Inventors:

Minoru Takahashi, Yokohama, JP;

Makoto Yoshimi, Tokyo, JP;

Naoyuki Shigyo, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257347 ; 257344 ; 257408 ;
Abstract

In a semiconductor device having a thin SOI film, the thickness of a semiconductor layer formed on an insulating film is so adjusted as to be less than a maximum distance allowable to complete depletion of the layer. While the thickness of a channel region is adjusted to be less than that of impurity-diffusion regions. Further, the insulating layer is so formed to have a thicker portion under the channel region, and thinner portions under the source region and the drain region as the impurity-diffusion regions. The semiconductor layer has steps at the boundaries between the channel region and the impurity-diffusion regions, and the top face of the channel region is arranged so as to be lower than the top faces of the impurity-diffusion regions. A region having a width less than the maximum depletion distance and an impurity concentration larger, than that of the channel region and less than that of the drain region is formed between the channel region and the drain region.


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