The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1996
Filed:
Dec. 20, 1994
Applicant:
Inventors:
Muneharu Ohara, Hasuda, JP;
Masakazu Mitsuhashi, Kitaadachi, JP;
Assignee:
Mitsui Mining and Smelting Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; B32B / ;
U.S. Cl.
CPC ...
428607 ; 428626 ; 428658 ; 428675 ; 428687 ; 428935 ; 205111 ;
Abstract
A printed circuit inner-layer copper foil having inverted tear drop-shaped fine nodules formed on both surfaces of a copper foil each having surface roughness Rz=1 to 3 .mu.m, the nodules having a length of 0.6 to 1.0 .mu.m and a maximum diameter of 0.2 to 0.8 .mu.m, and a process for producing said inner-layer copper foil.
Ohara, Muneharu. (1996). Printed circuit inner-layer copper foil and process for producing the (U.S. Patent No. 5482784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5482784
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile