Stacked high density interconnected integrated circuit system

Abstract

A three dimensional stacked integrated circuit system. The system includes a motherboard, a plurality of stacked integrated circuit subassemblies, and a plurality of Z-flex circuits coupled therebetween. The plurality of stacked integrated circuit subassemblies each comprise a base, an integrated circuit, and an X-Y flexprint circuit folded around the edges of the base that provides conducting paths thereto. The base comprises a heat conducting material, such as aluminum, aluminum nitride, alumina, beryllium oxide, or copper, for example. The X-Y flexprint circuits comprise printed interconnects that provide conducting paths between the motherboard and the integrated circuit subassemblies. The Z-flex printed circuits comprise a plurality of bumps that mate with a plurality of rings of the X-Y flexprint circuits, and a plurality of wrinkles that accommodate tolerance build up between the integrated circuit subassemblies. The Z-flex printed circuits may be single layer or multilayer flex circuits, or may comprise a lateral Z-flex printed circuit. The present invention thus interconnects several integrated circuits together to provide for a very high density, low weight, repairable microelectronic integrated circuit package. The system utilizes flexprint, bump, ring, and wire bonding (beam lead or tab) technologies that have been proven and tested for commercial and military applications. The system provides for a high density integrated circuit package that implements a thermal management scheme to maximize heat transfer away from the integrated circuits.