The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 1996
Filed:
Apr. 22, 1994
Yousuke Yamamoto, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
An apparatus for die bonding a semiconductor element to a submount with a soldering material includes a laser light source emitting laser light of a wavelength transmitting through the submount and a means for introducing the laser light emitted from the laser light source to a prescribed position and radiating the laser light to a required part of the submount. A method for die bonding a semiconductor element to a submount, includes placing a soldering material on the submount and placing the semiconductor element on the soldering material, radiating laser light of a wavelength transmitting through the submount from the rear surface side of the submount toward the soldering material so as to heat and melt the soldering material, and thereby bonding the semiconductor element to the submount. Thus, the die bonding is performed in a short time while observing the characteristic of the semiconductor element, so that deformation of the element or deterioration of the element characteristic during the die bonding is prevented even when the semiconductor element is subjected to a high temperature for a long time during the die bonding.