The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 1995
Filed:
Jun. 27, 1994
Il Ung Kim, Kyungki, KR;
Si Don Choi, Kyungki, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A die testing apparatus according to the present invention includes a lead frame having a plurality of die pads, wherein a plurality of bare chips are mounted on the die pads. The bonding pads of each bare chips are connected to a plurality of leads associated with each die pad through a plurality of bonding wires. The die pads are supported by a plurality of tie bars and the leads are supported by an adhesion tape attached to the lead frame. The lead frame is placed in a test socket which includes an under socket having a plurality of slot grooves and an upper socket hinged with the under socket and having a plurality of slot holes and a plurality of test probes contacting the leads of the lead frame. The lead frame is fixed between the upper and under sockets by means of a plurality of pins penetrating the slot holes and guiding holes located at a periphery of the lead frame and then being inserted into the slot grooves, and one side of the lead frame is caught between the upper and under sockets by a clamp. The test socket has a plug portion with electrical contacts thereon, which is located at an edge of the socket so that it can be plugged into a testing board.